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16
Computer
Published by the IEEE Computer Society
T E C H N O L O G Y N E W S
V
endors of computer-, net-
working-, and telecommu-
nications-related equip-
ment have long faced a
dilemma. Much of their
equipment is based on silicon and
copper wiring, which are inexpen-
sive to use but offer limited data
rates. Thus, as microprocessor and
networking speeds have increased,
the speed of communications within
chips, between chips or circuit
boards, within LANs, or even along
the “last mile” from ISPs to cus-
tomers has not kept pace.
An option is to use optical con-
nections for these communications.
“Any signal processing you can do
with electronics you can do faster
with light,” said Alfred University
professor Alexis Clare.
However, optics has been expensive
and, therefore, not suitable for any
but the largest networking operations
with the most traffic and the biggest
potential for return on investment.
Thus, optics has been used largely in
settings such as telecommunications
vendors’ backbone networks.
Optical connections have been im-
practical for communications on or
between chips because the shorter
distances involved yield fewer band-
width improvements, which don’t
justify the expense, said University
of Rochester distinguished professor
Philippe Fauchet.
Now, though, vendors are attempt-
ing to combine the best of both worlds
and offer silicon optics, which uses
complementary metal-oxide semicon-
ductor (CMOS) technology to fabri-
cate optical components on silicon.
This approach would speed up
traditionally silicon-based systems.
It could also reduce the cost of opti-
cal equipment and bring optical sys-
tems within reach of more users,
including companies and service
providers with networking opera-
tions smaller than those of large
telecommunications providers.
Combining silicon and optics is a
complex process. However, some
vendors are already selling some less
complex silicon-optical components.
Meanwhile, scientists are making
progress on more complicated com-
ponents. For example, Intel and
UCLA researchers have each devel-
oped prototype silicon lasers.
Nonetheless, obstacles remain, so
while some components are already
available, it may be years before sil-
icon optics can be widely and reli-
ably used commercially.
SILICON AND OPTICS
Transistors, diodes, and most
logic-control components in today’s
computers are silicon-based. Silicon
is found in sand, which is plentiful
and relatively inexpensive to process,
explained Clare.
Numerous fabrication plants have
worked with silicon for many years.
This enables high-volume produc-
tion and makes it easy for manufac-
turers to use the material and
integrate components. Moreover, as
a semiconductor, silicon is power-ef-
ficient and generates relatively low
amounts of heat.
However, silicon, working with
copper wiring, creates the binary
ones and zeros of data via electronic
pulses, so factors such as electrical
resistance and capacitance limit the
technology’s bandwidth.
Optics generates binary ones and
zeros via a modulated laser beam.
This makes the technology particu-
larly fast and able to handle large
quantities of data.
Typical electronic components
offer maximum data rates of 1 Gbit
per second, according to University
of Oklahoma professor Patrick J.
McCann. Proponents say silicon op-
tical components, on the other hand,
could offer rates as high as 40 Gbps
during the next few years.
In addition, light beams used in op-
tical transmissions can be split into
multiple communications channels
that can be multiplexed onto a single
link, thereby offering very high data
capacities, according to Fauchet.
Manufacturers frequently use ex-
otic materials like gallium arsenide
and indium phosphide with optical
components to maximize perfor-
mance and add special properties,
such as minimal light loss during
transmissions. However, these alloys
are expensive. “Indium, for example,
is a limited resource that must be
mined,” noted University of Mary-
land professor Thomas E. Murphy.
Silicon Optics
Aims to Combine
the Best of
Both Worlds
David Geer

Page 2
June 2006
17
ing the continuous laser beam’s [in-
tensity] in an external device (the
modulator). No one has succeeded
yet in building a silicon laser that
can be directly driven by an electri-
cal current.”
Manufacturers—such as IBM,
Intel, Kotura, and Luxtera—are cur-
rently developing new types of mod-
ulators that can convert electrical
signals to optical.
Amplifiers compensate for the loss
of light that occurs during the trans-
mission process by producing more
photons and thereby strengthening
signals.
Individual optical filters let only a
single set of signals pass onto specific
wavelengths within a laser beam.
This separates signals into discrete
groups of transmissions.
Waveguides direct the light as it
passes through open spaces within a
system, leading it around corners or
along paths other than a straight
line, noted Harold Hosack, director
of interconnect and packaging sci-
ence for Semiconductor Research,
a research-management consortium.
Optical switches move data be-
tween light paths, sending data
streams to their proper recipients.
In addition, using exotic materials
in manufacturing is difficult, time-
consuming, and costly. For example,
Clare explained, manufacturers
often must use specialized equip-
ment that deposits the materials as
vapors or a liquid, layer by layer.
WHEN SILCON MEETS OPTICS
US Air Force researchers pio-
neered silicon optoelectronics in the
mid 1980s for sophisticated com-
munications and signal processing,
said Richard Soref, research scien-
tist with the Air Force Research
Laboratory’s Sensors Directorate.
Since then, a variety of universities
and companies, such as Bookham
and Intel, have worked on silicon
optics.
Key issues
In most current silicon-optical de-
vices, such as waveguides and filters,
the silicon is used only as a passive
medium through which light can be
transmitted. These devices do not
tackle the more fundamental problem
of converting signals from optical to
electronic and vice versa, said the
University of Maryland’s Murphy.
This critical capability maximizes the
use of optical technology and in-
creases performance.
Many of today’s systems use pho-
todetectors that convert signals only
from optical to electronic.
Another key obstacle to achieving
true silicon optics has been the lack
of a silicon-based laser, noted
McCann. Semiconductor physics has
limited the ability to build such a laser.
The issue is bandgap: the energy dif-
ference between a material’s conduc-
tive and nonconductive state. Direct
bandgap semiconductors such as gal-
lium arsenide and other material used
in optics are efficient at emitting light,
while indirect bandgap semiconduc-
tors such as silicon are not.
Some researchers are looking into
techniques such as introducing other
materials that will make the silicon
transmit light more efficiently or
adding dopants that themselves
transmit light effectively, according
to University of Surrey professor
Graham Reed.
Meanwhile, scientists continue
looking for other ways to provide
silicon optics.
Silicon optical components
In silicon optics, manufacturers
build both the optical and electronic
components on a single silicon chip,
explained UCLA professor Bahram
Jalali. This reduces mass-manufac-
turing costs and simplifies packaging.
Vendors generally design silicon-
optical components to fit on a sili-
con substrate as part of a standard
CMOS manufacturing process, ac-
cording to Arlon Martin, vice pres-
ident for sales and marketing for
silicon-optics vendor Kotura.
The principal optical component
is the laser, shown in Figure 1, which
acts as the system’s light source.
“When an electrical current passes
through a semiconductor laser, it
emits a coherent beam of light (pho-
tons),” explained the University of
Maryland’s Murphy. “Information
can be encoded onto the optical
signal in two ways: by simply turn-
ing on and off the electrical current
that drives the laser or by modulat-
Waveguides devices
Photodetectors
Passive
align-
ment
CMOS
Source: Intel
1. Light source
2. Guide light
3. Modulation
4. Photodetection
5. Low-cost assembly
6. Intelligence
Figure 1.Intel is working with six building blocks for producing a silicon-optical
transceiver.(1) A laser produces the light that will eventually carry the data.(2)
Waveguides guide the light across the chip along the proper route.Splitters divide
the light into separate beams to carry multiple signal sets.(3) A modulator adds the
signal to the light beam at high rates.(4) A recipient’s photodetector decodes the
encoded light and turns the optical signal back into an electrical signal for
processing.(5) Passive alignment precisely but inexpensively aligns optical elements.
(6) Chip-based intelligence processes encoding and decoding.

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18
Computer
T E C H N O L O G Y N E W S
icon lasers. Manufacturers have had
trouble beaming lasers onto a chip
without causing heat, alignment,
and other problems.
Intel’s approach introduces pho-
tons onto a chip via a laser. It then
uses transistor-like devices to re-
move the buildup of electrons that
the light source creates, explained
Mario Paniccia, the company’s re-
search director. If not removed, the
electron cloud would absorb light
and interfere with the generation of
the continuous laser beam that is
necessary for proper modulation
and data transmission, he said.
Intel expects to have silicon lasers
ready for commercial use by the end
of this decade,” noted Victor Krutul,
the company’s director for enter-
prise-initiatives technology manage-
ment.
Replacing components
in optical systems
In addition to replacing compo-
nents in silicon-based systems to
make them faster, silicon optics can
also replace traditional optical com-
ponents in optical systems to make
them more affordable.
For example, Kotura is using sili-
con optics to make arrays of variable
optical attenuators, which incremen-
tally adjust the power of the signal
passing through an optical system,
according to the company’s Martin.
The VOAs are made of a silicon
chip with parallel waveguides.
Applying an electronic current
across the waveguide attenuates the
light, Martin explained.
Using silicon makes the manufac-
turing process less expensive and im-
proves the VOAs’ performance.
Manufacturers such as Intel are
also using silicon optics to make
modulators for optical systems.
USING SILICON OPTICS
Proponents see four primary ways
in which silicon optics could be used
in the near future.
LANs
Silicon-optical components could
replace existing transceivers in 1- and
10-Gbit Ethernet LANs. Because
LANs typically include many nodes
with many connections, the use of
silicon optics could improve overall
communications enough to justify
the expense, UCLA’s Jalali explained.
Equipment vendors are interested
in building silicon optics for LANs
in part because many corporations
use these networks and thus repre-
sent a lucrative market.
Communications
among components
While microprocessors have got-
ten faster, overall computer-perfor-
mance increases have been limited
because of slower communications
via data buses and along copper
wiring between chips and circuit
boards.
Using optical communications in-
stead of electrical wiring would be
faster, and silicon optics could keep
the implementation affordable.
On-chip communications
Silicon-optical interconnects could
replace copper wiring on chips, ac-
cording to Semiconductor Research’s
Hosack. A single chip would contain
most of the basic optical components
except for the light source.
Short, high-density interconnects
should be left in copper wiring be-
cause the necessary optical compo-
nents would be too large and require
too much power, noted Hosack.
Research into on-chip silicon op-
tics is ongoing. “Prototype wave-
guides and detectors for optical
interconnects are available,” Hosack
said. “However, the necessary exten-
sive studies of reliability and devel-
opment of cost-effective manufac-
turing methods have not been done.”
In addition, researchers have only
just begun developing prototype sil-
Silicon optics uses
CMOS technology
to fabricate optical
components on silicon.
STILL TO OVERCOME
Lasers use significant electricity,
which generates heat. This is a prob-
lem for chip-based silicon optics be-
cause manufacturers try to reduce
processors’ power usage and heat
generation.
Manufacturers must precisely
align optical elements such as wave-
guides and lasers so that light trans-
fers precisely from one component
to another. “If they are misaligned,
then light misses the receiving device
and is lost,” explained Reed. Proper
alignment can be a challenge during
the mass production of silicon-opti-
cal components.
Some silicon-optical elements,
such as waveguides, are relatively
large and thus occupy considerable
real estate on chips, particularly as
processors shrink in size. This causes
design challenges
In addition, replacing selected
electrical wires with optical inter-
connects can cause the loss of some
of the desired performance advan-
tage because of the time it takes to
transform electrical signals to opti-
cal signals and vice versa, said
Semiconductor Research Corp.’s
Hosack.
There can also be loss of light that
the material in waveguides absorbs.
Moreover, Reed said, waveguides
that interact with one another can
generate noise that interferes with
signal detection.
P
roponents say that during the
next few years, silicon-optical
components will shrink in size
and become more efficient, which
will encourage more widespread use.
And, they add, manufacturers and re-
searchers will demonstrate increas-
ingly complex integration of optical
technology with electronics.
Meanwhile, usage could increase
as more researchers and companies
work on silicon optics.
According to UCLA’s Jalali, the
greatest impact will be in enabling
low-cost optical transceivers for
communications over short dis-

Page 4
June 2006
19
tances such as those in interchip and
intrachip interconnects.
Because so many chips are made
and sold worldwide each year, the
biggest potential market for silicon
optics is on-chip interconnects, pre-
dicted Richard Wawrzyniak, an ana-
lyst at Semico Research, a semi-
conductor-market research firm.
Complex commercial silicon-op-
tical devices and applications will hit
the market within two years, Reed
said.
In the future, manufacturers could
develop ways to use silicon optics on
backplanes and to connect comput-
ers and peripherals. Also, noted
Reed, ISPs could use silicon optics to
cover the last-mile connection be-
tween their facilities and their cus-
tomers. This would be much faster
than DSL- or cable-based broad-
band, he said.
Wawrzyniak predicted that rev-
enue from silicon optics will increase
from $10 million this year to $1.8
billion by 2010.
“There will be an explosion of in-
terest in silicon photonics in the next
few years,” said Reed. “Maybe in 10
years, your laptop will rely on sili-
con photonics as much as it relies on
silicon electronics today. Silicon is
simply an excellent material for
mass production.”
David Geer is a freelance technology
journalist based in Ashtabula, Ohio. Con-
tact him at david@geercom.com.
Editor: Lee Garber, Computer,
l.garber@computer.org
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